High efficiency MWT cell technology
Introduction
Metal Wrap Through(MWT) is a new cell technology to increase the convertion effciency by reducing the busbars.By laser drilling, both the negative electrodes of solar cells are leading to the rear side together with the positive electrodes. Without busbars, it reduces shading area and improves efficiency on the cell.
Path
Step1. design the holes that go through the cells Step2. fill with conductive paste to direct the electrode from the front to the rear side via drilled holes Step3. isolate the back field. As both the positive and negative electrodes are on the rear side of the cells, it’s named as MWT Rear-Contact solar cell.
High efficiency MWT cells
Features
Without busbars- it reduces 3% shading area and improves efficiency more than 0.4% on the cell. Without welding strips-the welding stress and micro-crack caused by poor welding are eliminated, and it is also suitable for thinner silicon chips, helping to reduce costs. Technical compatibility - good compatibility with other technologies, including black silicon, PERC, etc.
Advantages
The MWT cell converges the current from the front to the back, and it is replaced by a dotted electrode on the back.There are many benefits.First, the consumption of silver pulp is reduced.Secondly, the shading area was reduced by 3% to 4%, and the efficiency was improved.Third, you can customize the patterns on the surface of the battery, such as panda and leaf patterns, for a higher level of appearance.
Technology Path
Technology Path
"MWT+" technology independently developed by Sunport Power is one of the key technologies recommended by Top Runner Project. Benchmark+ Series High Efficiency MWT Modules have multiple advantages of higher efficiency, higher actual power generation and low cost, and have alternative advantages for conventional technical products.Here is the "MWT+" battery technology path for the next few years of Sunport Power:
“MWT+”not only greatly improves the efficiency and reliability of cells and modules, but also is compatible with most of cell types including black silicon, PERC, HIT etc. More importantly, it can also develop key technologies such as ultra-thin silicon wafers and silver-free grid lines that cannot be used by conventional technologies.