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Max-Power
330W
Module Efficiency
21.53%
Power Tolerance
0~+5W
NMOT
43±2℃
Light, Thin Design
1.4mm thickness, 4.3kg weight, leading level in PV industry
BIPV Application
Further integrate with buildings in terms of shape and installation for BIPV application
High Efficiency
MWT back contact cell and modules with busbar-free design and higher efficiency
Ultra Flexible
Ultra-thin silicon wafers with advanced organic polymer encapsulation materials, minimum bending radius reach 0.25m
High Reliability
Conductive back sheet 2D encapsulation without welding, resulted lower degradation under multiple extreme testing condition
